HFA30PA60C Datasheet, PDF (2/7 Pages) International Rectifier – Ultrafast, Soft Recovery Diode

HFA30PA60C
Vishay High Power Products
HEXFRED^®
Ultrafast Soft Recovery Diode, 2 x 15 A
ELECTRICAL SPECIFICATIONS PER LEG (T_J = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
Cathode to anode
breakdown voltage
V_BR
I_R = 100 µA
600
-
I_F = 15 A
-
1.3
Maximum forward voltage
V_FM
I_F = 30 A
See fig. 1
-
1.5
I_F = 15 A, T_J = 125 °C
-
1.2
Maximum reverse
leakage current
V_R = V_R rated
-
1.0
I_RM
See fig. 2
T_J = 125 °C, V_R = 0.8 x V_R rated
-
400
Junction capacitance
C_T
V_R = 200 V
See fig. 3
-
25
Series inductance
L_S
Measured lead to lead 5 mm from package body
-
12
MAX.
-
1.7
2.0
1.6
10
1000
50
-
UNITS
V
µA
pF
nH
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (T_J = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
Reverse recovery time
See fig. 5, 10
t_rr
I_F = 1.0 A, dI_F/dt = 200 A/µs, V_R = 30 V
t_rr1
T_J = 25 °C
t_rr2
T_J = 125 °C
-
19
-
-
42
60
-
70
120
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
I_RRM1
I_RRM2
Q_rr1
Q_rr2
T_J = 25 °C
T_J = 125 °C
T_J = 25 °C
T_J = 125 °C
I_F = 15 A
dI_F/dt = 200 A/µs
V_R = 200 V
-
4.0
6.0
-
6.5
10
-
80
180
-
220
600
Peak rate of fall of
recovery current during t_b
See fig. 8
dI_(rec)M/dt1
dI_(rec)M/dt2
T_J = 25 °C
T_J = 125 °C
-
250
-
-
160
-
UNITS
ns
A
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Junction to case,
single leg conduction
Junction to case,
both legs conducting
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
T_lead
0.063” from case (1.6 mm) for 10 s
R_thJC
R_thJA
R_thCS
Typical socket mount
Mounting surface, flat, smooth and greased
Weight
Mounting torque
Marking device
Case style TO-247AC (JEDEC)
MIN.
-
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
MAX.
300
1.7
UNITS
°C
-
0.85
K/W
-
40
0.25
-
6.0
-
0.21
-
12
-
(10)
HFA30PA60C
g
oz.
kgf · cm
(lbf · in)
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Document Number: 93089
Revision: 29-Jul-08