HFA280NJ60CPBF Datasheet, PDF (2/7 Pages) Vishay Siliconix – HEXFRED® Ultrafast Soft Recovery Diode, 280 A

HFA280NJ60CPbF
Vishay High Power Products
HEXFRED^®
Ultrafast Soft Recovery
Diode, 280 A
DYNAMIC RECOVERY CHARACTERISTICS (T_J = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
Reverse recovery time
See fig. 5
I_F = 1.0 A, dI_F/dt = 200 A/µs, V_R = 30 V
-
39
t_rr
T_J = 25 °C
-
92
T_J = 125 °C
-
180
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
I_RRM
Q_rr
T_J = 25 °C
T_J = 125 °C
T_J = 25 °C
T_J = 125 °C
-
I_F = 105 A
-
dI_F/dt = 200 A/µs
V_R = 200 V
-
-
9.3
16
490
1400
Peak rate of recovery current
See fig. 8
dI_(rec)M/dt
T_J = 25 °C
T_J = 125 °C
-
290
-
200
MAX.
-
140
270
17
30
1200
4000
-
-
UNITS
ns
A
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage temperature range
Thermal resistance, junction to case
per leg
per module
T_J, T_Stg
R_thJC
Typical thermal resistance, case to heatsink
R_thCS
Weight
Mounting torque
Terminal torque
Vertical pull
2" lever pull
(1)
center hole
MIN.
- 55
-
-
-
-
-
30 (3.4)
12 (1.4)
30 (3.4)
-
-
TYP.
-
-
-
0.10
68
2.4
-
-
-
-
-
MAX.
150
0.19
0.095
-
-
-
40 (4.6)
18 (2.1)
40 (4.6)
80
35
UNITS
°C
°C/W
K/W
g
oz.
N⋅m
(lbf ⋅ in)
lbf ⋅ in
Note
(1) _{Mounting surface must be smooth, flat, free of burrs or other protrusions. Apply a thin even film or thermal grease to mounting surface.}
Gradually tighten each mounting bolt in 5 to 10 lbf ⋅ in steps until desired or maximum torque limits are reached.
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2
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Document Number: 94067
Revision: 01-Aug-08