DG2525 Datasheet, PDF (2/11 Pages) Vishay Siliconix – Break before make switching

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DG2525
Vishay Siliconix
ORDERING INFORMATION
TEMPERATURE RANGE
-40 °C to +85 °C lead (Pb)-free
PACKAGE
miniQFN-16
PART NUMBER
DG2525DN-T1-GE4
MIN. ORDER / PACK. QUANTITY
Tape and reel, 3000 units
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Reference to GND
V+
IN, COM, NC, NO ^a
Current (any terminal except NO, NC, or COM)
Continuous current (NO, NC, or COM)
Peak current (pulsed at 1 ms, 10 % duty cycle)
Storage temperature (D suffix)
Package solder reflow conditions ^d
miniQFN-16
Power dissipation (packages) ^b
miniQFN-16 ^c
LIMIT
-0.3 to +6
-0.3 to (V+ + 0.3)
30
± 300
± 500
-65 to +150
250
525
UNIT
V
mA
°C
mW
Notes
a. Signals on NC, NO, or COM, or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads welded or soldered to PC board.
c. Derate 6.6 mW/°C above 70 °C.
d. Manual soldering with iron is not recommended for leadless components. The miniQFN-16 is a leadless package. The end of the lead
terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip
cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
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Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S16-1508-Rev. B, 01-Aug-16
2
Document Number: 78295
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000