80PF140_12 Datasheet, PDF (2/8 Pages) Vishay Siliconix – Standard Recovery Diodes Generation 2 DO-5 (Stud Version), 80 A

80PF(R)...(W) High Voltage Series
Vishay High Power Products
Standard Recovery Diodes
Generation 2 DO-5 (Stud Version), 80 A
FORWARD CONDUCTION
PARAMETER
Maximum average forward current
at case temperature
Maximum RMS forward current
Maximum peak, one cycle forward,
non-repetitive surge current
SYMBOL
I_F(AV)
I_F(RMS)
I_FSM
Maximum I²t for fusing
I²t
Maximum I²âˆšt for fusing
Low level value of threshold voltage
Low level value of forward slope resistance
Maximum forward voltage drop
I²âˆšt
V_F(TO)
r_f
V_FM
TEST CONDITIONS
VALUES
80
180° conduction, half sine wave
123
126
t = 10 ms
t = 8.3 ms
No voltage
reapplied
1200
1250
t = 10 ms
t = 8.3 ms
t = 10 ms
t = 8.3 ms
100 % V_RRM
reapplied
No voltage
reapplied
Sinusoidal half wave,
initial T_J = 150 °C
1000
1050
7100
6450
t = 10 ms
t = 8.3 ms
100 % V_RRM
reapplied
5000
4550
t = 0.1 ms to 10 ms, no voltage reapplied
71 000
(16.7 % x π x I_F(AV) < I < π x I_F(AV)), T_J = T_J maximum
(16.7 % x π x I_F(AV) < I < π x I_F(AV)), T_J = T_J maximum
I_pk = 220 A, T_J = 25 °C, t_p = 400 µs rectangular wave
0.73
3.0
1.46
UNITS
A
°C
A
A
A²s
A²âˆšs
V
mΩ
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum junction and
storage temperature range
T_J, T_Stg
- 55 to 150
°C
Maximum thermal resistance,
junction to case
R_thJC
DC operation
0.30
K/W
Thermal resistance,
case to heatsink
R_thCS
Mounting surface, smooth, flat and greased
0.25
Not lubricated thread, tighting on nut ⁽¹⁾
3.4
(30)
Maximum allowable
mounting torque
(+ 0 %, - 10 %)
Lubricated thread, tighting on nut ⁽¹⁾
2.3
(20)
Not lubricated thread, tighting on hexagon ⁽²⁾
4.2
(37)
N·m
(lbf · in)
Lubricated thread, tighting on hexagon ⁽²⁾
3.2
(28)
Approximate weight
15.8
g
0.56
oz.
Case style
See dimensions - link at the end of datasheet
DO-203AB (DO-5)
Notes
(1) _{Recommended for pass-through holes}
(2) _{Torque must be appliable only to hexagon and not to plastic structure, recommended for holed heatsink}
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Document Number: 93527
Revision: 20-May-09