6N137 Datasheet, PDF (2/12 Pages) Toshiba Semiconductor – IRED & PHOTO IC (DEGITAL LOGIC ISOLATION, TELE-COMMUNICATION, ANALOG DATA EQUIPMENT CONTROL)

6N137, VO2601, VO2611, VO2630, VO2631, VO4661
High Speed Optocoupler, 10 MBd _{Vishay Semiconductors}
ORDER INFORMATION
PART
VO2631-X007
VO4661
VO4661-X006
VO4661-X007
Note
For additional information on the available options refer to option information.
TRUTH TABLE (Positive Logic)
LED
ON
OFF
ON
OFF
ON
OFF
ENABLE
H
H
L
L
NC
NC
REMARKS
5 kV/µs, dual channel, SMD-8
15 kV/µs, dual channel, DIP-8
15 kV/µs, dual channel, DIP-8 400 mil
15 kV/µs, dual channel, SMD-8
OUTPUT
L
H
H
H
L
H
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
INPUT
Average forward current
(single channel)
I_F
20
mA
Average forward current
(per channel for dual channel)
I_F
15
mA
Reverse input voltage
Enable input voltage
Enable input current
Surge current
Output power dissipation
(single channel)
t = 100 µs
V_R
5
V
V_E
V_CC + 0.5 V
V
I_E
5
mA
I_FSM
200
mA
P_diss
35
mW
Output power dissipation
(per channel for dual channel)
P_diss
25
mW
OUTPUT
Supply voltage
Output current
Output voltage
Output power dissipation
(single channel)
1 min maximum
V_CC
7
V
I_O
50
mA
V_O
7
V
P_diss
85
mW
Output power dissipation
(per channel for dual channel)
P_diss
60
mW
COUPLER
Isolation test voltage
Storage temperature
Operating temperature
Lead solder temperature
Solder reflow temperature ⁽²⁾
t = 1.0 s
for 10 s
V_ISO
T_stg
T_amb
5300
- 55 to + 150
- 40 to + 100
260
260
V_RMS
°C
°C
°C
°C
Notes
(1) _{Tamb = 25 °C, unless otherwise specified.}
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum
ratings for extended periods of the time can adversely affect reliability.
(2) _{Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through}
hole devices (DIP).
Document Number: 84732
Rev. 1.3, 06-Oct-08
For technical questions, contact: [e-mail]
www.vishay.com
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