572D107X06R3S2T Datasheet, PDF (18/20 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors TANTAMOUNT, Low Profile, Conformal Coated, Maximum CV

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Conformal Coated Guide
Vishay Sprague
RECOMMENDED REFLOW PROFILES
Capacitors should withstand Reflow profile as per J-STD-020 standard
T_p
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
T_L
T_{s max.}
Preheat area
T_{s min.}
t_s
t_p
T_c = 5 °C
t_L
25
PROFILE FEATURE
Preheat/soak
Temperature min. (T_{s min.})
Temperature max. (T_{s max.})
Time (t_s) from (T_{s min.} to T_{s max.})
Ramp-up
Ramp-up rate (T_L to T_p)
Liquidous temperature (T_L)
Time (t_L) maintained above T_L
Peak package body temperature (T_p)
Time (t_p)* within 5 °C of the specified
classification temperature (T_c)
Ramp-down
Ramp-down rate (T_p to T_L)
Time 25 °C to peak temperature
Time 25 °C to peak
TIME (s)
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
100 °C
150 °C
60 s to 120 s
150 °C
200 °C
60 s to 120 s
3 °C/s max.
3 °C/s max.
183 °C
217 °C
60 s to 150 s
60 s to 150 s
Depends on type and case – see table below
20 s
30 s
6 °C/s max.
6 min max.
6 °C/s max.
8 min max.
PEAK PACKAGE BODY TEMPERATURE (T_p)
TYPE/CASE CODE
591D/592D - all cases, except X25H, M and R cases
591D/592D - X25H, M and R cases
594D/595D - all cases except C, D and R
594D/595D - C, D and R case
572D all cases
T95 B, S, V, X, Y cases
T95 C, D, R and Z cases
T96 R case
195D all cases, except G, H, R and Z
195D G, H, R and Z cases
695D all cases, except G and H cases
695D G, H cases
597D, T97, T98 all cases, except V case
597D, T97, T98 V case
194D all cases, except H and G cases
194D H and G cases
PEAK PACKAGE BODY TEMPERATURE (T_p)
SnPb EUTECTIC PROCESS
LEAD (Pb)-FREE PROCESS
235 °C
260 °C
220 °C
250 °C
235 °C
260 °C
220 °C
250 °C
n/a
260 °C
235 °C
260 °C
220 °C
250 °C
220 °C
250 °C
235 °C
260 °C
220 °C
250 °C
235 °C
260 °C
220 °C
250 °C
220 °C
250 °C
230 °C
260 °C
235 °C
260 °C
220 °C
250 °C
Revision: 23-Jul-13
10
Document Number: 40150
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