VCNL4100 Datasheet, PDF (15/17 Pages) Vishay Siliconix – High Sensitivity Long Distance Proximity and Ambient Light Sensor with I2C Interface

www.vishay.com
RECOMMENDED INFRARED REFLOW
Soldering conditions which are based on J-STD-020 C.
IR REFLOW PROFILE CONDITION
PARAMETER
CONDITIONS
Peak temperature
Preheat temperature range and timing
Timing within 5 °C to peak temperature
Timing maintained above temperature / time
Timing from 25 °C to peak temperature
Ramp-up rate
Ramp-down rate

Recommend Normal Solder Reflow is 235 °C to 255 °C.
VCNL4100
Vishay Semiconductors
TEMPERATURE
255 °C + 0 °C / - 5 °C (max.: 260 °C)
150 °C to 200 °C
217 °C
3 °C/s (max.)
6 °C/s (max.)
TIME
10 s
60 s to 180 s
10 s to 30 s
60 s to 150 s
8 min (max.)
Max. Temperature
(260 °C + 0 °C / - 5 °C)/10 s
255
Ramp-Up Rate
Ramp-Down Rate
217
3 °C/s (max.)
6 °C/s (max.)
200
Ramp-Up Rate
3 °C/s (max.)
150
Pre-Heating Time
t₂ - t₁ = 60 s to 180 s
Soldering Zone
60 s to 150 s
t₁
t₂
Fig. 15 - VCNL4100 Solder Reflow Profile Chart
Time (s)
RECOMMENDED IRON TIP SOLDERING CONDITION AND WARNING HANDLING
1. Solder the device with the following conditions:
1.1. Soldering temperature: 400 °C (max.)
1.2. Soldering time: 3 s (max.)
2. If the temperature of the method portion rises in addition to the residual stress between the leads, the possibility that an
open or short circuit occurs due to the deformation or destruction of the resin increases.
3. The following methods: VPS and wave soldering, have not been suggested for the component assembly.
4. Cleaning method conditions:
4.1. Solvent: methyl alcohol, ethyl alcohol, isopropyl alcohol
4.2. Solvent temperature < 45 °C (max.)
4.3. Time: 3 minutes (min.)
Rev. 1.2, 30-Aug-16
15
Document Number: 84319
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000