TLMS1100-GS08 Datasheet, PDF (14/15 Pages) Vishay Siliconix – Standard 0603 SMD LED

TLMS1100, TLMO1100, TLMY1100, TLMG1100, TLMP1100, TLMB1100
www.vishay.com
Vishay Semiconductors
SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 2
300
250
225555 °C
240 °C
217 °C
200
150
100
max. 120 s
max. 260 °C
245 °C
max. 30 s
max. 100 s
50
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
0
0
50
19470-4
100
150
200
250
300
Time (s)
max. 2 cycles allowed
Fig. 34 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Aluminum bag
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity  60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label is
included on all dry bags.
Label
Reel
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
17028
Example of JESD22-A112 level 2 label
‘
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electro-static
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Rev. 2.4, 04-Jun-13
14
Document Number: 83173
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000