DG3408_11 Datasheet, PDF (13/14 Pages) Vishay Siliconix – Precision 8-Ch/Dual 4-Ch Low Voltage Analog Multiplexers

DG3408, DG3409
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 16-BUMP (4 x 4, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
6 X Ø 0.150 ~ 0.229
Note b
Solder Mask Ø ~ Pad Diameter + 0.1
A
A₂
0.5
A₁
4
3
2
1
0.5
b Diameter
Recommended Land Pattern
Index-Bump A1
e
Note c
e
XXX
3408
e
Top Side (Die Back)
S
S
e
e
e
D
Notes (Unless Otherwise Specified):
a. Bump is Lead Free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Silicon
Bump
Note a
A
B
E
C
D
Millimeters^a
Inches
Dim.
Min.
Max.
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A₁
0.218
0.258
0.0086
0.0102
A₂
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.980
2.020
0.0780
0.0795
E
1.980
2.020
0.0780
0.0795
e
0.5 BASIC
0.0197 BASIC
S
0.230
0.270
0.0091
0.0106
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72858.
Document Number: 72858
S11-0303-Rev. E, 28-Feb-11
www.vishay.com
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