BFC237021473 Datasheet, PDF (13/18 Pages) Vishay Siliconix – DC Film Capacitors MKT Radial Potted Type

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CHARACTERISTICS
16
MKT370
Vishay BCcomponents
16
12
12
8
8
4
4
0
- 60
- 20
20
60 _{Tamb (°C)} 100
Maximum allowed component temperature rise (T)
as a function of the ambient temperature (T_amb) for voltage 63 V
0
- 60
- 20
20
60 _{Tamb (°C)} 100
Maximum allowed component temperature rise (T)
as a function of the ambient temperature (T_amb) for voltages > 63 V
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY
THICKNESS IN mW/°C
W_max.
(mm)
2.5
3.5
4.5
6.0
HEAT CONDUCTIVITY (mW/°C)
PITCH 5 mm
2.5
3.0
4.0
5.5
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function
of the free ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film
Capacitors”.
The component temperature rise (T) can be measured (see section “Measuring the component temperature” for more details)
or calculated by T = P/G:
• T = Component temperature rise (°C)
• P = Power dissipation of the component (mW)
• G = Heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
Thermocouple
The temperature is measured in unloaded (T_amb) and maximum loaded condition (T_C).
The temperature rise is given by T = T_C - T_amb.
To avoid radiation or convection, the capacitor should be tested in a wind-free box.
Revision: 17-May-13
13
Document Number: 28108
For technical questions, contact: [e-mail]
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000