593D106X9025C2TE3 Datasheet, PDF (13/18 Pages) Vishay Siliconix – Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT, Molded Case, Low ESR

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Molded Guide
Vishay Sprague
RECOMMENDED REFLOW PROFILES
Capacitors should withstand Reflow profile as per J-STD-020 standard
T_p
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
T_L
T_{s max.}
Preheat area
T_{s min.}
t_s
t_p
T_C = 5 °C
t_L
25
PROFILE FEATURE
Preheat/soak
Temperature min. (T_{s min.})
Temperature max. (T_{s max.})
Time (t_s) from (T_{s min.} to T_{s max.})
Ramp-up
Ramp-up rate (T_L to T_p)
Liquidous temperature (T_L)
Time (t_L) maintained above T_L
Peak package body temperature (T_p)
Time (t_p) within 5 °C of the specified
classification temperature (T_C)
Time 25 °C to peak temperature
Ramp-down
Ramp-down rate (T_p to T_L)
Time 25 °C to peak
TIME (s)
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
100 °C
150 °C
60 s to 120 s
150 °C
200 °C
60 s to 120 s
3 °C/s max.
3 °C/s max.
183 °C
217 °C
60 s to 150 s
60 s to 150 s
Depends on case size - see table below
20 s
30 s
6 min max.
8 min max.
6 °C/s max.
6 °C/s max.
PEAK PACKAGE BODY TEMPERATURE (T_p)
CASE CODE
A, B, C, V
D, E, W
PEAK PACKAGE BODY TEMPERATURE (T_p)
SnPb EUTECTIC PROCESS
LEAD (Pb)-FREE PROCESS
235 °C
260 °C
220 °C
250 °C
PAD DIMENSIONS in inches [millimeters]
D
B
C
A
CASE CODE
A
(MIN.)
B
(NOM.)
C
(NOM.)
D
(NOM.)
293D - 593D - 893D - TR3 - TL3 - TH3 - TH4 - TH5 - TF3 - TP3 - 793DE/793DX/CTC3/CTC4 - T83 - T86 - CWR11 - 95158 - 04053
A
0.071 [1.80]
0.067 [1.70]
0.053 [1.35]
0.187 [4.75]
B
0.118 [3.00]
0.071 [1.80]
0.065 [1.65]
0.207 [5.25]
C
0.118 [3.00]
0.094 [2.40]
0.118 [3.00]
0.307 [7.80]
D
0.157 [4.00]
0.098 [2.50]
0.150 [3.80]
0.346 [8.80]
E
0.157 [4.00]
0.098 [2.50]
0.150 [3.80]
0.346 [8.80]
V
0.157 [4.00]
0.098 [2.50]
0.150 [3.80]
0.346 [8.80]
W
0.185 [4.70]
0.098 [2.50]
0.150 [3.80]
0.346 [8.80]
Revision: 27-Jun-12
34
Document Number: 40074
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