SMM0204_15 Datasheet, PDF (10/11 Pages) Vishay Siliconix – Thin Film Mini-MELF Resistors

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DIMENSIONS
L
K
L₁
SMM0204
Vishay Draloric
D₁
D
DIMENSIONS AND MASS
TYPE / SIZE
L
(mm)
D
(mm)
L_{1 min.}
(mm)
D₁
(mm)
K
(mm)
MASS
(mg)
SMM0204
OMM0204
3.6 + 0/- 0.2
1.4 + 0/- 0.1
1.8
D + 0/- 0.15
0.8 ± 0.1
22
Notes
• Color code marking is applied according to IEC 60062 ⁽¹⁾ in four bands (E24 series) for 5 % tolerance, or in five bands (E96 or E192 series).
Each color band appears as a single solid line, voids are permissible if at least ²/₃ of the band is visible from each radial angle of view. The
last color band for tolerance is approximately 50 % wider than the other bands.
PATTERN STYLES FOR MELF RESISTORS
G
X
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
SMM0204
OMM0204
G
(mm)
1.5
WAVE SOLDERING
Y
(mm)
X
(mm)
1.5
1.8
Z
(mm)
4.5
G
(mm)
1.7
REFLOW SOLDERING
Y
(mm)
X
(mm)
1.2
1.6
Z
(mm)
4.1
Notes
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly. Specified power rating above standard operation mode requires dedicated heat-sink pads, which to a great
extend depend on board materials and design. The given solder pad dimensions reflect the considerations for board design and assembly as
outlined e.g. in standards IEC 61188-5-x ⁽¹⁾, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly
as these are also strongly influenced by many other parameters.
Please note however that applications for "power operation mode" require special considerations for the design of solder pads and adjacent
conductor areas.
(1) _{The quoted IEC standards are also released as EN standards with the same number and identical contents.}
Revision: 17-Apr-15
10
Document Number: 20004
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