PR01 Datasheet, PDF (10/14 Pages) Vishay Siliconix – Power Metal Film Resistors

PR01/02/03
Vishay BCcomponents
Power Metal Film Resistors
100
∆T
(K)
80
60
40
15 mm
20 mm
25 mm
200
∆T
(K)
160
120
80
20
40
0
0
0.8
1.6 _{P (W)} 2.4
Ø0.8 mm FeCu-leads.
Minimum distance from resistor body to PCB = 1 mm.
PR02 Temperature rise (∆T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
0
0
1
Ø0.8 mm Cu-leads.
2
P (W)
3
PR03 Hot-spot temperature rise (∆T) as a function of
dissipated power.
100
∆T
(K)
80
60
40
20
15 mm
20 mm
25 mm
240
∆T
(K)
200
160
120
80
40
0
0
1
2
P (W)
3
Ø0.8 mm Cu-leads.
Minimum distance from resistor body to PCB = 1 mm.
PR03 Temperature rise (∆T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
0
0
1
Ø0.6 mm FeCu-leads.
2
P (W)
3
PR03 Hot-spot temperature rise (∆T) as a function of
dissipated power.
100
∆T
(K)
80
60
40
20
10 mm
15 mm
20 mm
25 mm
240
∆T
(K)
200
160
120
80
40
0
0
1
2
P (W)
3
Ø0.6 mm FeCu-leads.
Minimum distance from resistor body to PCB = 1 mm.
PR03 Temperature rise (∆T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
Application Information
0
0
1
Ø0.8 mm FeCu-leads.
2 _{P (W)} 3
PR03 Hot-spot temperature rise (∆T) as a function of
dissipated power.
www.vishay.com
10
For technical questions contact: [e-mail]
Document Number: 28729
Revision: 24-Feb-04