FX5959G701 Datasheet, PDF (10/11 Pages) Vishay Siliconix – Power LED Driver the Smallest and Low Profile, Constant Current Source 0 - 2.0A, 2.5V to 7V, with 450W/in3 Power Density and High Efficiency

FX5959G701
Vishay
SOLDERING PROFILE
All of the components must be dried prior to assembly as follows:
1.Samples and package type B1 and B5, bulk components - the recommended drying process is to be done at 125°C for 48 hours.
2. For package type T1 and T2 - per JEDEC J-STD-033 level5.
For taped components the recommended drying process is to be done at maximum 70°C.
RECOMMENDED SOLDERING PROFILE
217°C/sec
250
Max
200
150
100 ^{0.5-2.5°C/sec}
0.5-1°C/sec
30-60sec
Pre-Heating
zone
Time above
liquidus
30-90sec
2.5°C/sec
Max
50
0
50
100
150
200
250
300
Time (sec)
RECOMMENDED LEAD (PB)-FREE SOLDERING PROFILE
250
235°C
+
-
0°C
5°C
200
150
100 ^{0.5-2.5°C/sec}
0.5-1°C/sec
Time above
liquidus
30-90sec
30-60sec
Pre-Heating
zone
2.5°C/sec
Max
50
0
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84
50
100
150
200
250
300
Time (sec)
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350
400
Document Number: 10135
Revision: 18-Jan-05