VSMS3700 Datasheet, PDF (1/7 Pages) Vishay Siliconix – Infrared Emitting Diode, RoHS Compliant, 950 nm, GaAs

VSMS3700
Vishay Semiconductors
Infrared Emitting Diode, RoHS Compliant, 950 nm, GaAs
94 8553
DESCRIPTION
VSMS3700 is an infrared, 950 nm emitting diode in GaAs
technology, molded in a PLCC-2 package for surface
mounting (SMD).
FEATURES
• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• Peak wavelength: λ_p = 950 nm
• High reliability
• Angle of half intensity: ϕ = ± 60°
• Low forward voltage
• Suitable for high pulse current operation
• Good spectral matching with Si photodetectors
• Package matched with IR emitter series VEMT3700
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Lead (Pb)-free component in accordance with
RoHS 2002/95/EC and WEEE 2002/96/EC
APPLICATIONS
• Infrared source in tactile keyboards
• IR diode in low space applications
• PCB mounted infrared sensors
• Emitter in miniature photo-interrupters
PRODUCT SUMMARY
COMPONENT
I_e (mW/sr)
VSMS3700
4.5
Note
Test conditions see table “Basic Characteristics”
ϕ (deg)
± 60
λ_P (nm)
950
t_r (ns)
800
ORDERING INFORMATION
ORDERING CODE
VSMS3700-GS08
VSMS3700-GS18
Note
MOQ: minimum order quantity
PACKAGING
Tape and reel
Tape and reel
REMARKS
MOQ: 7500 pcs, 1500 pcs/reel
MOQ: 8000 pcs, 8000 pcs/reel
PACKAGE FORM
PLCC-2
PLCC-2
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Reverse voltage
Forward current
Peak forward current
Surge forward current
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
Note
T_amb = 25 °C, unless otherwise specified
TEST CONDITION
t_p/T = 0.5, t_p = 100 µs
t_p = 100 µs
acc. figure 11, J-STD-020
J-STD-051, soldered on PCB
SYMBOL
V_R
I_F
I_FM
I_FSM
P_V
T_j
T_amb
T_stg
T_sd
R_thJA
VALUE
5
100
200
1.5
170
100
- 40 to + 85
- 40 to + 100
260
250
UNIT
V
mA
mA
A
mW
°C
°C
°C
°C
K/W
www.vishay.com
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For technical questions, contact: [e-mail]
Document Number: 81373
Rev. 1.2, 04-Sep-08