VFCP Datasheet, PDF (1/5 Pages) Vishay Siliconix – Ultra High Precision Z-Foil Flip Chip Resistor with TCR of ± 0.05 ppm/°C, 35 % Space Saving versus Wraparound Design and PCR of 5 ppm at Rated Power

VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
Ultra High Precision Z-Foil Flip Chip Resistor with TCR
of ± 0.05 ppm/°C, 35 % Space Saving versus
Wraparound Design and PCR of 5 ppm at Rated Power
Bottom View
Any value at tolerance available within resistance range
INTRODUCTION
One of the most important parameters influencing stability is
the Temperature Coefficient of Resistance (TCR). Although
the TCR of Bulk Metal^® Foil resistors is considered extremely
low, this characteristic has been further refined over the
years.
The VFCP Series utilizes ultra precision Bulk Metal^® Z-Foil.
The Z-Foil technology provides a significant reduction to the
resistive element’s sensitivity to ambient temperature
variations (TCR) and to self heating when power is applied
(power coefficient).
FEATURES
• Temperature Coefficient of Resistance (TCR):
± 0.05 ppm/°C typical (0 °C to + 60 °C)
± 0.2 ppm/°C typical (- 55 °C to + 125 °C, +
25 °C Ref.)
T _{• Tolerance: to ± 0.01 % (100 ppm)}
• Power Coefficient “ΔR due to self heating”
5 ppm at Rated Power
Pb-free
Available
RoHS*
COMPLIANT
C • Load Life Stability (70 °C for 2000 hours):
± 0.005 % (50 ppm)
• Power Rating to: 600 mW at + 70 °C
U ^{• Electrostatic Discharge (ESD) above 25 000 V}
• Resistance Range: 10Ω to 150 kΩ (for lower and higher
values, please contact us)
• Non Inductive, Non Capacitive Design
D _{• Short time overload ≤ 0.005 % (50 ppm)}
• Non hot spot design
• Rise time: 1ns without ringing
O _{• Current Noise: - 40 dB}
• Voltage Coefficient < 0.1 ppm/V
• Non Inductive: < 0.08 µH
R • Terminal Finishes available: Lead (Pb)-free
Tin/Lead Alloy
P^{• Matched sets are available per request}
Along with the inherently low PCR and TCR, Z-Foil
technology also provides remarkably improved load life
stablility, low noise and availability of tight tolerance.
The Flip Chip configuration provides a substantial PCB
D _{space saving of more than 35 % vs. a surface mount chip}
with wraparound terminations. The VFCP is available in any
E value within the specified resistance range.
Our Application Engineering Department is available to
advise and make recommendations. For non-standard
V _{technical requirements and special applications, please}
contact us.
O _{TABLE 1 - TOLERANCE AND TCR VS}
RESISTANCE VALUE
R _{RESISTANCEVALUE}
P^(Ω)
TOLERANCE
(%)
TYPICAL TCR AND
MAX. SPREAD
(- 55 °C to + 125 °C,
+ 25 °C Ref.)
250 to 150K
± 0.01
± 0.2 ± 1.6
100 to < 250
± 0.02
± 0.2 ± 1.6
IM^{50 to < 100}
± 0.05
± 0.2 ± 1.8
• Any value available within resistance range (e.g. 1K2345)
• Prototype samples available from 48 hours. For more
information, please contact [e-mail]
• For better performances please contact us
APPLICATIONS
• Automatic Test Equipment (ATE)
• High Precision Instrumentation
• Laboratory, Industrial and Medical
• Audio
• EB Applications (electron beam scanning and recording
equipment, electron microscopes)
• Military and Space
• Airborne
• Down Hole instrumentation
• Communication
FIGURE 1 - POWER DERATING CURVE
- 55 °C
100
+ 70 °C
75
50
25
25 to < 50
10 to < 25
± 0.1
± 0.25
± 0.2 ± 2.8
± 0.2 ± 2.8
0
- 75 - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 63106
Revision: 28-Jun-07
For any questions, contact: [e-mail]
www.vishay.com
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