VCS2516 Datasheet, PDF (1/2 Pages) Vishay Siliconix – Bulk Metal Foil Technology Surface Mount Current Sensing Chip Resistors

VCS2516
Vishay Foil Resistors
Bulk Metal^® Foil Technology
Surface Mount Current Sensing Chip Resistors
Product may not
be to scale
INTRODUCTION
Model VCS2516 are surface mount resistors designed with
4 pads for kelvin connection. Utilizing Vishay Bulk Metal^®
Foil as the resistance element, they provide performance
capabilities far greater than other resistor technologies can
supply in a product of comparable size.
These small devices dissipate the heat almost entirely
through the pads so surface mount users are encouraged to
be generous with the pads and board traces. Some hybrid
users may want to use conductive epoxy for the
interconnection and gold terminations are available on
special order. (Tin/lead oxidizes on the surface and the
conductive epoxy joint eventually fails electrically.)
Lead (Pb)-free terminations (100% Sn) are also availiable.
Our Application Engineering Department is prepared to
advise and to make recommendations for non standard
technical requirements and special applications, Please
contact us.
FIGURE 1 - DIMENSIONS in inches and millimeters
FEATURES
• Low Ohmic Values: 0.01Ω to 1.0Ω
• Low Temperature Coefficient of Resistance (TCR):
10ppm/°C, nominal (- 55°C to + 125°C, + 25°C Ref.)
• Tight Resistance Tolerance: to ± 0.1%
• High Power Rating: 1 watt at + 85°C
• Current Rating: 5 Amperes maximum
• Low Thermal EMF: 0.05µV/°C typical
• Low Current Noise: - 40dB
• Low Voltage Coefficient: < 0.1ppm/V
• Non Inductive: < 0.08µH
TERMINATIONS
• Lead (Pb)-free two options are available:
Gold Plated
Tin Plated
• Tin/Lead (Sn 60% Pb 40%) Plated
APPLICATIONS
• Automatic test equipment (ATE)
• Airborne (in heads-up display systems)
• High precision instrumentation
R2
• Electron beam recording equipment
• Electron microscopes
R1
Vin
-
• Current sensing applications
Vout
+
• Forced balance electronic scales
• Applications that require superior frequency stability etc.
L
H
Top View
W
Mounting _A
Pads (4)
I1
E1 _B
I2
E2
Bottom View
.070
(1.78)
.260
(6.60)
Solder Pad Layout
I₁
E₁
R
I2 _Electrical E₂
Schematic
DIMENSIONS
L
H
W
A
B
INCHES
0.250 ± 0.010
0.160 ± 0.010
0.040 maximum
0.080 ± 0.005
0.040 ± 0.010
mm
6.35 ± 0.25
4.06 ± 0.25
1.02 maximum
2.03 ± 0.13
1.02 ± 0.25
SALES
• ISRAEL: [e-mail] • FRANCE/SWITZERLAND/SOUTHERN EUROPE: [e-mail] • AMERICAS: [e-mail]
• ASIA/JAPAN: [e-mail] • UK/HOLLAND/SCANDINAVIA: [e-mail] • GERMANY/CZECH REPUBLIC/AUSTRIA: [e-mail]
www.vishay.com
32
For technical questions in the Americas, contact [e-mail]
Document Number: 63023
For technical questions in Asia/Japan/Europe/Africa/Israel, contact [e-mail]
Revision 26-Jan-05