TFDU6100E Datasheet, PDF (1/12 Pages) Vishay Siliconix – 2.7-5.5V Fast Infrared Transceiver Module Family

TELEFUNKEN
Semiconductors
TFDU6100E/TFDS6500E/TFDT6500E
2.7–5.5V Fast Infrared Transceiver Module Family
(FIR, 4 Mbit/s)
Features
Applications
D Compliant to IrDA 1.2 (Up to
4 Mbit/s), HP–SIR, Sharp ASK
and TV Remote
D Wide Operating Voltage Range
(2.7 to 5.5 V )
D Low-Power Consumption (3 mA
Supply Current)
D Power Shutdown Mode (1 mA
Shutdown Current)
D Long Range (Up to 2.0 m at
4 Mbit/s in Nominal Design)
D High Efficiency Emitter
(120 mW/sr min "15_)
D Three Surface Mount Package
Options
– Universal (9.7 x 4.7 x 4.0 mm)
– Side View (13.0x5.95x5.3mm)
– Top View (13.0x7.6x5.95mm)
D BabyFace (Universal) Package
Capable of Surface Mount
Solderability to Side and Top
View Orientation
D Directly Interfaces With Various
Super I/O and Controller Devices
D Built–In EMI Protection – No
External Shielding Necessary
D Few External Components
Required
D Backward Compatible to All
TEMIC SIR and FIR Infrared
Transceivers
D Notebook Computers, Desktop
PCs, Palmtop Computers (Win
CE, Palm PC), PDAs
D Digital Still and Video Cameras
D Printers, Fax Machines,
Photocopiers, Screen Projectors
D Telecommunication Products
(Cellular Phones, Pagers)
D Internet TV Boxes, Video
Conferencing Systems
D External Infrared Adapters
(Dongles)
D Medical and Industrial Data
Collection Devices
Description
The TFDU6100E, TFDS6500E, and TFDT6500E are a
family of low-power infrared transceiver modules
compliant to the IrDA 1.2 standard for fast infrared (FIR)
data communication, supporting IrDA speeds up to 4.0
Mbit/s, HP–SIR, Sharp ASK and carrier based remote
control modes up to 2 MHz. Integrated within the
transceiver modules are a photo PIN diode, infrared
emitter (IRED), and a low-power CMOS control IC to
provide a total front–end solution in a single package.
TEMIC’s FIR transceivers are available in three package
options, including our BabyFace package (TFDU6100E),
the smallest FIR transceiver available on the market. This
wide selection provides flexibility for a variety of
applications and space constraints.
The transceivers are capable of directly interfacing with
a wide variety of I/O chips which perform the pulse-width
modulation/demodulation function, including National
Semiconductor’s PC87338, PC87108 and PC87109,
SMSC’s FDC37C669, FDC37N769 and CAM35C44,
and Hitachi’s SH3. At a minimum, a current-limiting
resistor in series with the infrared emitter and a V_CC
bypass capacitor are the only external components
required to implement a complete solution.
Package Options
TFDU6100E
Baby Face (Universal)
TFDS6500E
Side View
TFDT6500E
Top View
This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.
Pending—Rev. A, 03-Apr-98
1
Pre-Release Information