SQS423EN_15 Datasheet, PDF (1/14 Pages) Vishay Siliconix – Automotive P-Channel 30 V (D-S) 175 °C MOSFET

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SQS423EN
Vishay Siliconix
Automotive P-Channel 30 V (D-S) 175 °C MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () at V_GS = - 10 V
R_DS(on) () at V_GS = - 4.5 V
I_D (A)
Configuration
- 30
0.021
0.060
- 16
Single
PowerPAK^® 1212-8
FEATURES
• TrenchFET^® Power MOSFET
• AEC-Q101 Qualified^d
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
S
3.30 mm
D
8
D
7
D
6
Part Marking Code: Q006
S
1
S
2
D
5
Bottom View
3.30 mm
S
3
G
4
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
PowerPAK 1212-8
SQS423EN-T1-GE3
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_C = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
Continuous Drain Current^a
T_C = 25 °C
T_C = 125 °C
I_D
Continuous Source Current (Diode Conduction)^a
I_S
Pulsed Drain Current^b
I_DM
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
Maximum Power Dissipation^b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_C = 25 °C
T_C = 125 °C
P_D
T_J, T_stg
LIMIT
- 30
± 20
- 16
- 16
- 16
- 64
- 22
24
62.5
20
- 55 to + 175
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
LIMIT
UNIT
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount^c
R_thJA
81
°C/W
R_thJC
2.4
Notes
a. Package limited.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
c. When mounted on 1" square PCB (FR4 material).
d. Parametric verification ongoing.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S12-1845-Rev. C, 30-Jul-12
1
Document Number: 70317
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000