SQJ951EP_15 Datasheet, PDF (1/11 Pages) Vishay Siliconix – Automotive Dual P-Channel 30 V (D-S) 175 °C MOSFET

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SQJ951EP
Vishay Siliconix
Automotive Dual P-Channel 30 V (D-S) 175 °C MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω) at V_GS = - 10 V
R_DS(on) (Ω) at V_GS = - 4.5 V
I_D (A)
Configuration
PowerPAK^® SO-8L Dual
- 30
0.017
0.036
- 30
Dual
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• AEC-Q101 Qualified^d
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
S₁
S₂
6.15 ^mm
D
2
D
1
4
G2
3
S2
2
G1
1
S1
Bottom View
5.13 _mm
G₁
G₂
D₁
P-Channel MOSFET
D₂
P-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
PowerPAK SO-8L
SQJ951EP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_C = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
Continuous Drain Current
T_C = 25 °C^a
T_C = 125 °C
I_D
Continuous Source Current (Diode Conduction)^a
I_S
Pulsed Drain Current^b
I_DM
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
Maximum Power Dissipation^b
T_C = 25 °C
T_C = 125 °C
P_D
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_J, T_stg
LIMIT
- 30
± 20
- 30
- 28
- 30
- 120
- 27
36.5
56
18.5
- 55 to + 175
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
LIMIT
UNIT
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount^c
R_thJA
85
°C/W
R_thJC
2.7
Notes
a. Package limited.
b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
c. When mounted on 1" square PCB (FR4 material).
d. Parametric verification ongoing.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S12-0316-Rev. A, 27-Feb-12
1
Document Number: 63658
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000