SQJ570EP Datasheet, PDF (1/10 Pages) Vishay Siliconix – Automotive N-and P-Channel 100 V (D-S) 175 °C MOSFET

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SQJ570EP
Vishay Siliconix
Automotive N- and P-Channel 100 V (D-S) 175 °C MOSFET
PRODUCT SUMMARY
N-CHANNEL P-CHANNEL
V_DS (V)
R_DS(on) () at V_GS = ± 10 V
R_DS(on) () at V_GS = ± 4.5 V
I_D (A)
Configuration
100
-100
0.0450
0.1460
0.0580
0.2065
15
-9.5
N- and P-Pair
Package
PowerPAK SO-8L Dual
PowerPAK^® SO-8L Dual
FEATURES
• TrenchFET^® power MOSFET
• AEC-Q101 qualified
• 100 % R_g and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
D₁
S₂
6.15 _mm
1
Top View
5.13 ^mm
D1
D2
1
2 ^S1
3 ^G1
4 ^S2
G₂
Bottom View
G₂
G₁
S₁
N-Channel MOSFET
D₂
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_C = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
N-CHANNEL
P-CHANNEL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
Continuous Drain Current
T_C = 25 °C
T_C = 125 °C
I_D
Continuous Source Current (Diode conduction) ^a
I_S
Pulsed Drain Current ^b
I_DM
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
100
-100
± 20
15 ^a
-9.5
9.6
-5.5
15
-15
40
-21
13
-6
8.4
1.8
Maximum Power Dissipation ^b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) ^{d, e}
T_C = 25 °C
T_C = 125 °C
P_D
T_J, T_stg
27
27
9
9
-55 to +175
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
Junction-to-Case (Drain)
PCB mount ^c
SYMBOL
R_thJA
R_thJC
N-CHANNEL
85
5.5
P-CHANNEL
85
5.5
UNIT
°C/W
Notes
a. Package limited.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
c. When mounted on 1" square PCB (FR4 material).
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S16-1462-Rev. A, 01-Aug-16
1
Document Number: 76453
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000