SQJ500AEP_15 Datasheet, PDF (1/16 Pages) Vishay Siliconix – Automotive N- and P-Channel 40 V (D-S) 175 °C MOSFET

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SQJ500AEP
Vishay Siliconix
Automotive N- and P-Channel 40 V (D-S) 175 °C MOSFET
PRODUCT SUMMARY
N-CHANNEL P-CHANNEL
V_DS (V)
R_DS(on) () at V_GS = ± 10 V
R_DS(on) () at V_GS = ± 4.5 V
I_D (A)
Configuration
40
-40
0.0092
0.0270
0.0112
0.0435
30
-30
N- and P-Pair
PowerPAK^® SO-8L Dual
FEATURES
• TrenchFET^® Power MOSFET
• AEC-Q101 Qualified^d
• 100 % R_g and UIS Tested
• Material categorization: 
For definitions of compliance please see
www.vishay.com/doc?99912
D₁
S₂
6.15 _mm
1
5.13 ^mm
Top View
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
D1
D2
1
2 ^S1
3 ^G1
4 ^S2
G₂
Bottom View
G₂
G₁
S₁
N-Channel MOSFET
D₂
P-Channel MOSFET
PowerPAK SO-8L
SQJ500AEP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_C = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
N-CHANNEL
P-CHANNEL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current^a
Continuous Source Current (Diode Conduction)^a
Pulsed Drain Current^b
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation^b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_C = 25 °C
T_C = 125 °C
L = 0.1 mH
T_C = 25 °C
T_C = 125 °C
V_DS
V_GS
I_D
I_S
I_DM
I_AS
E_AS
P_D
T_J, T_stg
40
-40
± 20
30
-30
30
-18
30
-30
120
-120
26.5
-25
35
31
48
48
16
16
-55 to +175
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
N-CHANNEL
P-CHANNEL
UNIT
Junction-to-Ambient
Junction-to-Case (Drain)
PCB Mount^c
R_thJA
85
R_thJC
3.1
85
°C/W
3.1
Notes
a. Package limited.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
c. When mounted on 1" square PCB (FR4 material).
d. Parametric verification ongoing.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S13-2581-Rev. A, 23-Dec-13
1
Document Number: 62878
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000