SQ7415AEN Datasheet, PDF (1/14 Pages) Vishay Siliconix – Automotive P-Channel 60 V (D-S) 175 °C MOSFET

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SQ7415AEN
Vishay Siliconix
Automotive P-Channel 60 V (D-S) 175 °C MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () at V_GS = - 10 V
R_DS(on) () at V_GS = - 4.5 V
I_D (A)
Configuration
PowerPAK 1212-8
3.30 mm
S
1
S
3.30 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Marking Code: Q014
- 60
0.065
0.090
- 16
Single
S
G
D
P-Channel MOSFET
FEATURES
• TrenchFET^® Power MOSFET
• PowerPAK^® Package
- Low Thermal Resistance, R_thJC 
- Low 1.07 mm Profile
• AEC-Q101 Qualified^d
• 100 % R_g and UIS Tested
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
PowerPAK 1212-8
SQ7415AEN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Continuous Source Current (Diode Conduction)^a
Pulsed Drain Current^b
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation^b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_C = 25 °C^a
T_C = 125 °C
L = 0.1 mH
T_C = 25 °C
T_C = 125 °C
V_DS
V_GS
I_D
I_S
I_DM
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
- 60
± 20
- 16
- 11
- 16
- 64
- 23
26
53
17
- 55 to + 175
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
LIMIT
UNIT
Junction-to-Ambient
PCB Mount^c
R_thJA
81
°C/W
Junction-to-Case (Drain)
R_thJC
2.8
Notes
a. Package limited.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
c. When mounted on 1" square PCB (FR-4 material).
d. Parametric verification ongoing.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S13-1891, Rev. C, 26-Aug-13
1
Document Number: 67042
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000