SISS98DN Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 200 V (D-S) MOSFET

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SiSS98DN
Vishay Siliconix
N-Channel 200 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
200
R_DS(on) () (MAX.)
0.105 at V_GS = 10 V
0.110 at V_GS = 7.5 V
I_D (A) ^a
14.1
13.8
Q_g (TYP.)
9.3 nC
PowerPAK^® 1212-8S _D
D
D
6
D
7
8
5
3.3 _mm
1
Top View
3.3 ^mm
1
4
3
S
2
S
S
G
Bottom View
Ordering Information: 
SiSS98DN-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• ThunderFET^® power MOSFET
• Optimized Q_g and Q_oss improve efficiency
• 100 % R_g and UIS tested
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
D
• Primary side switching
• Synchronous rectification
• DC/DC converters
G
• Boost converters
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
200
± 20
14.1
11.2
4.1 ^{b, c}
3.2 ^{b, c}
30
14.1
4.3 ^{b, c}
10
5
57
36
4.8 ^{b, c}
3 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
21
Steady State
R_thJC
1.7
26
°C/W
2.2
Notes
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
S16-0992-Rev. A, 23-May-16
1
Document Number: 66781
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000