SISS27ADN Datasheet, PDF (1/7 Pages) Vishay Siliconix – P-Channel 30 V (D-S) MOSFET

www.vishay.com
SiSS27ADN
Vishay Siliconix
P-Channel 30 V (D-S) MOSFET
PowerPAK^® 1212-8S _D
D
D
6
D
7
8
5
3.3 _mm
1
Top View
3.3 ^mm
PRODUCT SUMMARY
V_DS (V)
R_DS(on) max. () at V_GS = -10 V
R_DS(on) max. () at V_GS = -6 V
R_DS(on) max. () at V_GS = -4.5 V
Q_g typ. (nC)
I_D (A) ^{a, g}
Configuration
1
4
3
S
2
S
S
G
Bottom View
-30
0.0051
0.0068
0.0081
36.6
-50
Single
FEATURES
• TrenchFET^® Gen III p-channel power MOSFET
• Low thermal resistance PowerPAK^® package
with small size and low 0.75 mm profile
• 100 % R_g and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
S
• Battery management in mobile devices
• Adapter and charger switch
• Battery switch
G
• Load switch
D
P-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8S
SiSS27ADN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-source voltage
Gate-source voltage
Continuous drain current (T_J = xx °C)
Pulsed drain current (t = 100 μs)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
Maximum power dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) ^{d, e}
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
-30
± 20
-50 ^a
-50 ^a
-24.3 ^{b, c}
-19.4 ^{b, c}
-200
-47.5
-4 ^{b, c}
-25
31
57
36
4.8 ^{b, c}
3.1 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient ^{b, f}
t  10 s
R_thJA
21
Maximum junction-to-case (drain)
Steady state
R_thJC
1.7
26
2.2
°C/W
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 63 °C/W.
g. T_C = 25 °C.
S16-1833-Rev. A, 12-Sep-16
1
Document Number: 75459
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000