SISS23DN Datasheet, PDF (1/9 Pages) Vishay Siliconix – P-Channel 20 V (D-S) MOSFET

P-Channel 20 V (D-S) MOSFET
SiSS23DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.0045 at V_GS = - 4.5 V
- 20
0.0063 at V_GS = - 2.5 V
0.0115 at V_GS = - 1.8 V
I_D (A)
- 50^e
- 50^e
- 50^e
PowerPAK 1212-8S
Q_g (Typ.)
93 nC
3.3 mm
3.3 mm
S
S
1
2
S
G
34
0.75 mm
D
8
D
7
D
6
D
5
Bottom View
Ordering Information:
SiSS23DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• Low Thermal Resistance PowerPAK^®
Package with Small Size and Low 0.75 mm
Profile
• 100 % R_g and UIS Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Smart Phones, Tablet PCs, Mobile
S
Computing
- Battery Switch
- Load Switch
- Power Management
G
- Battery Management
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 µs)
V_DS
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
I_DM
- 20
V
±8
- 50^e
- 50^e
- 27^{a, b}
- 21^{a, b}
A
- 200
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 47.5
- 4^{a, b}
Avalanche Current
Single-Pulse Avalanche Energy
I_AS
L = 0.1 mH
E_AS
- 23
26
mJ
Maximum Power Dissipation
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
57
36
4.8^{a, b}
W
3^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{c, d}
T_J, T_stg
- 50 to 150
°C
260
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Package limited.
Document Number: 62852
For technical questions, contact: [e-mail]
www.vishay.com
S13-1162-Rev. A, 13-May-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000