SISA72DN Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 40 V (D-S) MOSFET

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SiSA72DN
Vishay Siliconix
N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
40
R_DS(on) () (MAX.)
0.0035 at V_GS = 10 V
0.0048 at V_GS = 4.5 V
I_D (A) ^{f, g}
60
60
Q_g (TYP.)
19.5 nC
PowerPAK^® 1212-8 Single
D
D8
D7
D6
5
3.3 _mm
1
Top View
3.3 ^mm
1
2_S
3_S
4_S
G
Bottom View
Ordering Information: 
SiSA72DN-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• TrenchFET^® Gen IV power MOSFET
• 100 % R_g and UIS tested
• Tuned for the lowest R_DS-Q_oss FOM
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• DC/DC power supplies
• Synchronous rectification
• Motor drive control
• Telecom POL and bricks
G
• Battery protection
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 100 μs)
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{c, d}
T_J, T_stg
LIMIT
40
+20, -16
60 ^g
60 ^g
24.2 ^{a, b}
19.5 ^{a, b}
150
47.2
3.3 ^{a, b}
20
20
52
33.3
3.7 ^{a, b}
2.4 ^{a, b}
-55 to 150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^{a, e}
Maximum Junction-to-Case (Drain)
t  10 s
Steady State
SYMBOL
R_thJA
R_thJC
TYPICAL
24
1.9
MAXIMUM
33
2.4
UNIT
°C/W
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T_C = 25 °C.
g. Package limited.
S16-1125-Rev. A, 06-Jun-16
1
Document Number: 75680
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000