SISA18DN Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET

New Product
N-Channel 30 V (D-S) MOSFET
SiSA18DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () (Max.)
30
0.0075 at V_GS = 10 V
0.0120 at V_GS = 4.5 V
I_D (A)^f
38.3
30.2
Q_g (Typ.)
6.9 nC
PowerPAK^® 1212-8
3.30 mm
D
8
D
7
D
6
D
5
S
1
S
3.30 mm
2
S
3
G
4
Bottom View
Ordering Information:
SiSA18DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Gen IV Power MOSFET
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• DC/DC Power Supplies
D
• High Current Power Rails in Computing
• Telecom POL and Bricks
• Battery Protection
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
+ 20, - 16
T_C = 25 °C
38.3
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
30.6
15.3^{a, b}
T_A = 70 °C
12.1^{a, b}
A
Pulsed Drain Current (t = 300 µs)
I_DM
70
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
18
2.9^{a, b}
Single Pulse Avalanche Current
L = 0.1 mH
I_AS
10
Single Pulse Avalanche Energy
E_AS
5
mJ
T_C = 25 °C
19.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
12.7
3.2^{a, b}
W
T_A = 70 °C
3^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{c, d}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{a, e}
Maximum Junction-to-Case (Drain)
t  10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
31
5
Maximum
39
6.3
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T_C = 25 °C.
Document Number: 62579
For technical questions, contact: [e-mail]
www.vishay.com
S12-2051-Rev. A, 27-Aug-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000