 English |
|
|
|
|
|
|
|
| SIS888DN Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 150 V (D-S) MOSFET | |||
| |||
|
www.vishay.com
SiS888DN
Vishay Siliconix
N-Channel 150 V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) (ï) (MAX.)
150
0.058 at VGS = 10 V
0.085 at VGS = 7.5 V
ID (A)f
20.2
16.6
Qg (TYP.)
7.6 nC
3.3 mm
PowerPAK 1212-8S
3.3 mm
S
1
S
2
S
3
G
4
0.75 mm
D
8
D
7
Ordering Information:
D
6
D
5
Bottom View
SiS888DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
⢠ThunderFET® technology optimizes balance of
RDS(on), Qg, Qsw and Qoss
⢠100 % Rg and UIS tested
⢠Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
⢠Primary side switch
⢠Synchronous rectification
⢠DC/DC conversion
⢠Load switching
⢠Boost converters
⢠DC/AC inverters
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Pulsed Drain Current (t = 300 μs)
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
TC = 25 °C
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) c,d
VDS
VGS
ID
IDM
IS
IAS
EAS
PD
TJ, Tstg
LIMIT
150
± 20
20.2
16
5.3 a,b
4.3 a,b
50
40 g
3.1 a,b
10
5
52
33
3.7 a,b
2.4 a,b
-55 to 150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient a,e
t ï£ 10 s
RthJA
26
Maximum Junction-to-Case (Drain)
Steady State
RthJC
1.9
33
°C/W
2.4
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on TC = 25 °C.
g. Package limited.
S13-2288-Rev. A, 04-Nov-13
1
Document Number: 63548
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese