SIS444DN Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET

New Product
N-Channel 30 V (D-S) MOSFET
SiS444DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () Max.
0.0033 at V_GS = 10 V
0.0043 at V_GS = 4.5 V
I_D (A)^f
35^g
35^g
Q_g (Typ.)
33.5 nC
PowerPAK^® 1212-8
3.30 mm
D
8
D
7
D
6
D
5
S
1
S
3.30 mm
2
S
3
G
4
Bottom View
Ordering Information:
SiS444DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Motor Control
• Industrial
• Load Switch
• ORing
D
G
N-Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V_GS
± 20
V
T_C = 25 °C
35^g
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
35^g
24.9^{a, b}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
I_DM
20^{a, b}
70
A
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
35^g
3.3^{a, b}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
20
20
mJ
T_C = 25 °C
52
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
43
3.7^{a, b}
W
T_A = 70 °C
3.1^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{c, d}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{a, e}
t  10 s
Maximum Junction-to-Case (Drain)
Steady State
Symbol
R_thJA
R_thJC
Typical
24
1.9
Maximum
33
2.4
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T_C = 25 °C.
g. Package limited.
Document Number: 63276
www.vishay.com
S11-1379-Rev. A, 11-Jul-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000