SIS435DNT Datasheet, PDF (1/8 Pages) Vishay Siliconix – P-Channel 20-V (D-S) MOSFET

P-Channel 20-V (D-S) MOSFET
SiS435DNT
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.0054 at V_GS = - 4.5V
0.0060 at V_GS = - 3.7 V
- 20
0.0083 at V_GS = - 2.5 V
0.0140 at V_GS = - 1.8 V
I_D (A)^a
- 30^a
- 30^a
- 30^a
- 30^a
Thin PowerPAK® 1212-8
Q_g (Typ.)
57 nC
3.3 mm
S
33
1
S
2
S
3
G
4
D
8
D
7
3.3 mm
D
6
D
5
Bottom View
Ordering Information:
SiS435DNT-T1-GE3 (Lead (Pb)-free and Halogen-free)
0.8 mm
FEATURES
• TrenchFET^® Gen III P-Channel Power MOSFET
• Thin 0.8 mm max. height
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Smart Phones, Tablet PCs, and
S
Mobile Computing
- Battery Switch
- Load Switch
G
- Power Management
- Battery Management
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 20
V
V_GS
±8
T_C = 25 °C
- 30^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 30^a
- 22^{b, c}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
- 17^{b, c}
A
I_DM
- 80
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 30^a
- 3.1^{b, c}
Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
- 20
E_AS
20
mJ
T_C = 25 °C
39
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
25
3.7^{b, c}
W
T_A = 70 °C
2.4^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
Notes:
t  10 s
R_thJA
24
Steady State
R_thJC
2.4
33
°C/W
3.2
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The Thin PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
Document Number: 63264
For technical questions, contact: [e-mail]
www.vishay.com
S13-0465-Rev. A, 04-Mar-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000