SIS427EDN Datasheet, PDF (1/13 Pages) Vishay Siliconix – P-Channel 30-V (D-S) MOSFET

P-Channel 30-V (D-S) MOSFET
SiS427EDN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.0106 at V_GS = - 10 V
- 30
0.0160 at V_GS = - 6 V
0.0213 at V_GS = - 4.5 V
I_D (A)^{d, g}
- 50^d
- 42.1
- 31.3
Q_g (Typ.)
22.6 nC
PowerPAK^® 1212-8
3.30 mm
S
1
S
3.30 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information:
SiS427EDN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Typical ESD Performance: 2500 V (HBM)
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Notebook Battery Charging
S
• Notebook Adapter Switch
• Load Switch/Power Management
for Mobile Computing
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 µs)
V_DS
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
I_DM
- 30
V
± 25
- 50^d
- 44.3
- 15^{a, b}
- 12^{a, b}
A
- 110
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
T_C = 25 °C
T_A = 25 °C
I_S
L = 0.1 mH
I_AS
E_AS
- 43
- 3.1^{a, b}
- 25
31.25
mJ
T_C = 25 °C
52
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
33
3.7^{a, b}
W
2.4^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{a, c}
Maximum Junction-to-Case
t 10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
26
1.9
Maximum
33
2.4
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under steady state conditions is 81 °C/W.
d. Package limited.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
g. Based on T_C = 25 °C.
Document Number: 62856
For technical questions, contact: [e-mail]
www.vishay.com
S13-1164-Rev. A, 13-May-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000