SIS412DN Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 30-V (D-S) MOSFET

New Product
N-Channel 30-V (D-S) MOSFET
SiS412DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
I_D (A)^a
0.024 at V_GS = 10 V
12
30
0.030 at V_GS = 4.5 V
12
PowerPAK 1212-8
Q_g (Typ.)
3.8 nC
3.30 mm
S
1
S
3.30 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
FEATURES
• Halogen-free According to IEC 61249-2-21
• TrenchFET^® Power MOSFET
• 100 % R_g Tested
APPLICATIONS
• Notebook PC
- System Power
- Load Switch
D
G
S
Ordering Information: SiS412DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
12^a
8.7^{b, c}
Pulsed Drain Current
T_A = 70 °C
7^{b, c}
A
I_DM
30
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
12^a
2.7^{b, c}
Single Pulse Avalanche Current
L = 0.1 mH
I_AS
5
Single Pulse Avalanche Energy
E_AS
1.25
mJ
T_C = 25 °C
15.6
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
10
3.2^{b, c}
W
T_A = 70 °C
2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, d}
t ≤ 10 s
R_thJA
32
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
6.5
39
°C/W
8
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 81 °C/W.
e. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 69006
S09-0135-Rev. C, 02-Feb-09
www.vishay.com
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