SIS407ADN Datasheet, PDF (1/13 Pages) Vishay Siliconix – P-Channel 20 V (D-S) MOSFET

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SiS407ADN
Vishay Siliconix
P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
-20
R_DS(on) (Ω) MAX.
0.009 at V_GS = -4.5 V
0.0122 at V_GS = -2.5 V
0.0190 at V_GS = -1.8 V
I_D (A) ^{f, g}
-18
-18
-18
Q_g (TYP.)
63 nC
PowerPAK^® 1212-8 Single
D
D8
D7
D6
5
FEATURES
• TrenchFET^® power MOSFET
• Low thermal resistance PowerPAK^® package
• 100 % R_g and UIS tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Load switch
• Battery switch
• Power management
S
G
3.3 _mm
1
3.3 ^mm
1
2_S
3_S
4_S
G
Top View
Bottom View
Ordering Information:
SiS407ADN-T1-GE3 (lead (Pb)-free and halogen-free)
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C) ^a
Pulsed Drain Current (t = 300 μs)
Continuous Source-Drain Diode Current
Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{c, d}
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
-20
±8
-18 ^f
-18 ^f
-16.7 ^{a, b}
-13.4 ^{a, b}
-70
-18 ^f
-3.1 ^{a, b}
-20
20
39.1
25
3.7 ^{a, b}
2.4 ^{a, b}
-55 to 150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{a, e}
Maximum Junction-to-Case (Drain)
t ≤ 10 s
R_thJA
26
Steady State
R_thJC
2.4
34
°C/W
3.2
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Package limited.
g. T_C = 25 °C.
S14-0911-Rev. A, 28-Apr-14
1
Document Number: 63239
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000