SIRB40DP Datasheet, PDF (1/13 Pages) Vishay Siliconix – Dual N-Channel 40 V (D-S) MOSFET

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SiRB40DP
Vishay Siliconix
Dual N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
40
R_DS(on) () MAX.
0.00325 at V_GS = 10 V
0.00420 at V_GS = 4.5 V
I_D (A) ^{a, g}
40
40
Q_g (TYP.)
29.5 nC
PowerPAK^® SO-8 Dual
D₁
D_{1 8}
D_{2 7}
D_{2 6}
5
FEATURES
• TrenchFET^® Gen IV power MOSFET
• Tuned for the lowest R_DS-Q_oss FOM
• Q_gd/Q_gs ratio < 1 optimizes switching characteristics
• 100 % R_g and UIS tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• DC/DC converters
D₁
D₂
6.15 _mm
1
Top View
5.15 ^mm
1
2 S₁
3 G₁
4 S₂
G₂
Bottom View
Ordering Information: 
SiRB40DP-T1-GE3 (lead (Pb)-free and halogen-free)
• DC/AC inverters
• Synchronous rectification _G1
G₂
• Battery and load switch
S₁
N-Channel
MOSFET
S₂
N-Channel
MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) ^{d, e}
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
40
+20, -16
40 ^g
40 ^g
24.4 ^{b, c}
19.8 ^{b, c}
100
30 ^g
3.1 ^{b, c}
25
31.25
46.2
29.6
3.5 ^{b, c}
2.3 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
25
Steady State
R_thJC
2.2
35
°C/W
2.7
Notes
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
g. Package limited.
S16-1324-Rev. A, 04-Jul-16
1
Document Number: 68578
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000