SIR876ADP Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 100 V (D-S) MOSFET

New Product
N-Channel 100 V (D-S) MOSFET
SiR876ADP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
100
R_DS(on) (Ω) Max.
0.0108 at V_GS = 10 V
0.0114 at V_GS = 7.5 V
0.0145 at V_GS = 4.5 V
I_D (A)^a
40
40
40
PowerPAK^® SO-8
Q_g (Typ.)
16.3 nC
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information:
SiR876ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• DC/DC Primary Side Switch
• Telecom/Server 48 V, Full/Half-Bridge DC/DC
• Industrial
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
T_C = 25 °C
40^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
40^a
15.2^{b, c}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
12.1^{b, c}
A
I_DM
80
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
40^a
4.5^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
25
E_AS
31.2
mJ
T_C = 25 °C
62.5
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
40
5^{b, c}
W
T_A = 70 °C
3.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t ≤ 10 s
R_thJA
20
Steady State
R_thJC
1.6
25
°C/W
2
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
Document Number: 63580
www.vishay.com
S11-2241-Rev. A, 14-Nov-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000