SIR874DP Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 25-V (D-S) MOSFET

New Product
N-Channel 25-V (D-S) MOSFET
SiR874DP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
25
0.0094 at V_GS = 10 V
0.012 at V_GS = 4.5 V
PowerPAK SO-8
I_D (A)^{a, g}
20
20
Q_g (Typ.)
8 nC
6.15 mm
S
1
S
5.15 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information: SiR874DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Gen III Power MOSFET
• Low Thermal Resistance PowerPAK^®
Package with Low 1.07 mm Profile
• Optimized for High-Side Synchronous Rectifier
Operation
• 100 % R_g Tested
• 100 % UIS Tested
D
• Compliant to RoHS Directive 2002/96/EC
APPLICATIONS
• Notebook CPU Core
G
- High-Side Switch
• Game Machine DC/DC High-Side
• Server DC/DC High-Side
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
25
V_GS
± 20
V
T_C = 25 °C
20^g
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
20^g
15^{b, c}
Pulsed Drain Current
T_A = 70 °C
I_DM
12^{b, c}
50
A
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
20^g
3.2^{b, c}
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
I_AS
20
E_AS
20
mJ
T_C = 25 °C
29.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
19.0
3.9^{b, c}
W
T_A = 70 °C
2.5^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
27
3.5
Maximum
32
4.2
Unit
°C/W
Notes:
a. Base on T_C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 70 °C/W.
g. Packaged Limited.
Document Number: 64813
S09-0663-Rev. A, 20-Apr-09
www.vishay.com
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