SIR670DP Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 60 V (D-S) MOSFET

N-Channel 60 V (D-S) MOSFET
SiR670DP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.0048 at V_GS = 10 V
60
0.0060 at V_GS = 6 V
0.0078 at V_GS = 4.5 V
I_D (A)
60^a
60^a
60^a
PowerPAK^® SO-8
Q_g (Typ.)
18.5 nC
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information:
SiR670DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Primary Side Switching
• Synchronous Rectification
• DC/DC Converters
• Boost Converters
• DC/AC Inverters
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
60
V_GS
± 20
V
T_C = 25 °C
60^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
60^a
24^{b, c}
Pulsed Drain Current (t = 100 µs)
T_A = 70 °C
19.2^{b, c}
A
I_DM
200
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
60^a
4.5^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L =0.1 mH
I_AS
E_AS
25
31.2
mJ
T_C = 25 °C
56.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
36.3
5^{b, c}
W
T_A = 70 °C
3.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
20
Steady State
R_thJC
1.8
25
°C/W
2.2
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
Document Number: 62863
For technical questions, contact: [e-mail]
www.vishay.com
S13-1384-Rev. A, 17-Jun-13
This document is subject to change without notice.
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000