SIR622DP Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 150 V (D-S) MOSFET

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SiR622DP
Vishay Siliconix
N-Channel 150 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
150
R_DS(on) () MAX.
0.0177 at V_GS = 10 V
0.0204 at V_GS = 7.5 V
I_D (A) ^g
51.6
48.1
PowerPAK^® SO-8 Single
D
D8
D7
D6
5
Q_g (TYP.)
20.7 nC
6.15 _mm
1
Top View
5.15 ^mm
1
2S
3S
4S
G
Bottom View
Ordering Information:
SiR622DP-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• ThunderFET^® technology optimizes balance
of R_DS(on), Q_g, Q_sw and Q_oss
• 100 % R_g and UIS tested
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
D
• Fixed telecom
• DC/DC converter
• Primary and secondary side switch
• Battery management
G
• Synchronous rectification
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
I_DM
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) ^{d, e}
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
150
± 20
51.6
41.3
12.6 ^{b, c}
10.1 ^{b, c}
100
60 ^a
5.6 ^{b, c}
40
80
104
66.6
6.25 ^{b, c}
4 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
15
Steady State
R_thJC
0.9
20
°C/W
1.2
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 54 °C/W.
g. T_C = 25 °C
S16-0991-Rev. A, 23-May-16
1
Document Number: 75758
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000