SIR616DP Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 200 V (D-S) MOSFET

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SiR616DP
Vishay Siliconix
N-Channel 200 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
200
R_DS(on) () MAX.
0.0505 at V_GS = 10 V
0.0535 at V_GS = 7.5 V
I_D (A) ^g
20.2
19.7
PowerPAK^® SO-8 Single
D
D8
D7
D6
5
Q_g (TYP.)
18.3 nC
6.15 _mm
1
Top View
5.15 ^mm
1
2S
3S
4S
G
Bottom View
Ordering Information:
SiR616DP-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• ThunderFET^® technology optimizes balance
of R_DS(on), Q_g, Q_sw, and Q_oss
• 100 % R_g and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• Fixed telecom
• DC/DC converter
• Primary and secondary side switch
• Synchronous rectification
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
Continuous Drain Current (T_J = 150 °C)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) ^{d, e}
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
200
± 20
20.2
16.1
6.2 ^{b, c}
5.0 ^{b, c}
50
24
4.5 ^{b, c}
20
20
52
33
5 ^{b, c}
3.2 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
20
Steady State
R_thJC
1.9
25
°C/W
2.4
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
g. T_C = 25 °C.
S16-0993-Rev. A, 23-May-16
1
Document Number: 67834
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000