SIR164DP Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 30-V (D-S) MOSFET

New Product
N-Channel 30-V (D-S) MOSFET
SiR164DP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.0025 at V_GS = 10 V
30
0.0032 at V_GS = 4.5 V
PowerPAK SO-8
I_D (A)^{a, e}
50
50
Q_g (Typ.)
40.6 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Gen III Power MOSFET
• New MOSFET Technology Optimized for
Ringing Reduction in Switching Application
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information: SiR164DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
APPLICATIONS
• DC/DC
• Notebook CPU Core
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
50^e
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
50^e
33.3^{b, c}
Pulsed Drain Current
T_A = 70 °C
26.5^{b, c}
A
I_DM
70
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
50^e
4.7^{b, c}
Single Pulse Avalanche Current
L = 0.1 mH
I_AS
40
Avalanche Energy
E_AS
80
mJ
T_C = 25 °C
69
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
44.4
5.2^{b, c}
W
T_A = 70 °C
3.3^{b, c}
Operating Junction and Storage Temperature Range
T_J, T_stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)^{f, g}
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, d}
t ≤ 10 s
R_thJA
19
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
1.2
24
°C/W
1.8
Notes:
a. Based on T_C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 65 °C/W.
e. Package limited.
f. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
g. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 64827
S09-0701-Rev. A, 27-Apr-09
www.vishay.com
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