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SIHP16N50C Datasheet, PDF (1/8 Pages) Vishay Siliconix – Gate Charge Improved Compliant to RoHS Directive 2002/95/EC
SiHP16N50C, SiHB16N50C, SiHF16N50C
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
VDS (V) at TJ max.
RDS(on) (Ω)
Qg (Max.) (nC)
Qgs (nC)
Qgd (nC)
Configuration
560 V
VGS = 10 V
68
17.6
21.8
Single
TO-220AB
TO-220 FULLPAK
0.38
D
FEATURES
• Low Figure-of-Merit Ron x Qg
• 100 % Avalanche Tested
• Gate Charge Improved
• Trr/Qrr Improved
• Compliant to RoHS Directive 2002/95/EC
S
D
G
D2PAK (TO-263)
GDS
G
GD
S
S
N-Channel MOSFET
ORDERING INFORMATION
Package
TO-220AB
Lead (Pb)-free
SiHP16N50C-E3
D2PAK (TO-263)
SiHB16N50C-E3
TO-220 FULLPAK
SiHF16N50C-E3
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
LIMIT
PARAMETER
TO220-AB
SYMBOL D2PAK (TO-263)
TO-220
FULLPAK
Drain-Source Voltage
VDS
500
Gate-Source Voltage
VGS
± 30
Continuous Drain Current (TJ = 150 °C)a
TC = 25 °C
VGS at 10 V
ID
16
TC = 100 °C
10
Pulsed Drain Currentc
IDM
40
Linear Derating Factor
2
Single Pulse Avalanche Energyb
EAS
320
Maximum Power Dissipation
PD
250
38
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d
for 10 s
TJ, Tstg
- 55 to + 150
300
Notes
a. Limited by maximum junction temperature.
b. VDD = 50 V, starting TJ = 25 °C, L = 2.5 mH, Rg = 25 Ω, IAS = 16 A.
c. Repetitive rating; pulse width limited by maximum junction temperature.
d. 1.6 mm from case.
UNIT
V
A
W/°C
mJ
W
°C
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91401
S10-0811-Rev. A, 12-Apr-10
www.vishay.com
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