SIE844DF Datasheet, PDF (1/10 Pages) Vishay Siliconix – N-Channel 30-V (D-S) MOSFET

New Product
N-Channel 30-V (D-S) MOSFET
SiE844DF
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.007 at V_GS = 10 V
30
0.010 at V_GS = 4.5 V
I_D (A)^e
44.5
37.3
Q_g (Typ.)
13.1 nC
Package Drawing
www.vishay.com/doc?72945
10 9 8
7
D GS
S
PolarPAK
6
D
6
7
8 9 10
D
D
S
GD
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Gen II Power MOSFET
• Ultra Low Thermal Resistance Using Top-
Exposed PolarPAK^® Package for Double-
Sided Cooling
• Leadframe-Based New Encapsulated Package
- Die Not Exposed
- Same Layout Regardless of Die Size
• Low Q_gd/Q_gs Ratio Helps Prevent Shoot-Through
• 100 % R_g and UIS Tested
• Compliant to RoHS directive 2002/95/EC
APPLICATIONS
D
• VRM, POL
• DC/DC Conversion
• Server
• High-Side Switch
G
D GS
S
D
1 23
4
5
Top View
5
4
32 1
Bottom View
Top surface is connected to pins 1, 5, 6, and 10
Ordering Information: SiE844DF-T1-E3 (Lead (Pb)-free)
SiE844DF-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel MOSFET
For Related Documents
www.vishay.com/ppg?69988
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V_GS
± 20
V
T_C = 25 °C
44.5
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
35.6
20.3^{a, b}
Pulsed Drain Current
T_A = 70 °C
16.3^{a, b}
A
I_DM
60
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
20.8
4.3^{a, b}
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
I_AS
E_AS
25
31
mJ
T_C = 25 °C
25
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
16
5.2^{a, b}
W
T_A = 70 °C
3.3^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{c, d}
T_J, T_stg
- 55 to 150
260
°C
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See Solder Profile (www.vishay.com/ppg?73257). The PolarPAK is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Based on T_C = 25 °C.
Document Number: 69988
S09-1338-Rev. B, 13-Jul-09
www.vishay.com
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