SIB441EDK Datasheet, PDF (1/9 Pages) Vishay Siliconix – P-Channel 12-V (D-S) MOSFET

New Product
P-Channel 12-V (D-S) MOSFET
SiB441EDK
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.0255 at V_GS = - 4.5 V
0.0280 at V_GS = - 3.7 V
- 12
0.0360 at V_GS = - 2.5 V
0.0600 at V_GS = - 1.8 V
0.1150 at V_GS = - 1.5 V
I_D (A)
- 9^a
- 9^a
- 9^a
- 9^a
-2
Q_g (Typ.)
13.4 nC
PowerPAK SC-75-6L-Single
S
1
D
2
D
3
G
D
G
6
D
S
5
1.60 mm ^S
4
1.60 mm
D
Ordering Information:
SiB441EDK-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
FEATURES
• TrenchFET^® Power MOSFET
• Thermally Enhanced PowerPAK^®
SC-75 Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Performance 2500 V
• 100 % R_g Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Portable Devices such as Smart Phones, Tablet PCs and
Mobile Computing
- Battery Switch
- Load Switch
- Power Management
Marking Code
Part # code
BOX
XXX
Lot Traceability
and Date code
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 12
V
V_GS
±8
T_C = 25 °C
- 9^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 9^a
- 8.3^{b, c}
T_A = 70 °C
- 6.6^{b, c}
A
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
I_DM
T_C = 25 °C
T_A = 25 °C
I_S
- 40
- 9^a
- 2^{b, c}
T_C = 25 °C
13
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
8.4
2.4^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
R_thJA
41
Steady State
R_thJC
7.5
51
°C/W
9.5
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 62821
For technical questions, contact: [e-mail]
www.vishay.com
S13-0197-Rev. A, 28-Jan-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000