SIB433EDK Datasheet, PDF (1/9 Pages) Vishay Siliconix – P-Channel 20-V (D-S) MOSFET

P-Channel 20-V (D-S) MOSFET
SiB433EDK
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) ()
0.058 at V_GS = - 4.5 V
- 20
0.077 at V_GS = - 2.5 V
0.105 at V_GS = - 1.8 V
I_D (A)
- 9^a
- 9^a
-5
Q_g (Typ.)
7.6 nC
PowerPAK SC-75-6L-Single
D
6
D
5
1.60 mm ^S
4
1
D
2
D
3
G
S
1.60 mm
Ordering Information:
SiB433EDK-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-75 Package
- Small Footprint Area
- Low On-Resistance
• 100 % R_g Tested
• Typical ESD Performance 2000 V
• Built in ESD Protection with Zener Diode
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Load Switch for Portable Devices
S
• Charger Switch for Portable
Devices
Marking Code
G
Part # code
BLX
XXX
Lot Traceability
and Date code
R
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 20
V
V_GS
±8
T_C = 25 °C
- 9^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 9^a
- 5.3^{b, c}
T_A = 70 °C
- 4.3^{b, c}
A
Pulsed Drain Current
I_DM
- 20
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 9^a
- 2^{b, c}
T_C = 25 °C
13
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
8.4
2.4^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
Symbol
R_thJA
R_thJC
Typical
41
7.5
Maximum
51
9.5
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 65652
For technical support, please contact: [e-mail]
www.vishay.com
S12-0979-Rev. B, 30-Apr-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000