SIB422EDK Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 20-V (D-S) MOSFET

New Product
N-Channel 20-V (D-S) MOSFET
SiB422EDK
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
20
R_DS(on) (Ω)
0.030 at V_GS = 4.5 V
0.041 at V_GS = 2.5 V
0.057 at V_GS = 1.8 V
I_D (A)^a
9
9
9
Q_g (Typ.)
6 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-75 Package
0.082 at V_GS = 1.5 V
5
- Small Footprint Area
- Low On-Resistance
- Thin 0.75 mm Profile
PowerPAK SC-75-6L-Single
• Typical ESD Protection 4000 V
• 100 % R_g Tested
D
• Compliant to RoHS Directive 2002/95/EC
1
D
2
D
3
D
G
6
Marking Code
AFX
APPLICATIONS
• Portable Devices
- Load Switch
- Battery Switch
R
G
D
S
5
Part # code
XXX
1.60 mm ^S
4
1.60 mm
Lot Traceability
and Date code
Ordering Information: SiB422EDK-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
V_GS
±8
V
T_C = 25 °C
9^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
9^a
7.1^{b, c}
T_A = 70 °C
5.7^{b, c}
A
Pulsed Drain Current
I_DM
25
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
9^a
2.1^{b, c}
T_C = 25 °C
13
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
8.4
2.5^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
Symbol
R_thJA
R_thJC
Typical
41
7.5
Maximum
51
9.5
Unit
°C/W
Notes:
a. Package limited, T_C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 65297
S09-1919-Rev. A, 28-Sep-09
www.vishay.com
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