SI7997DP Datasheet, PDF (1/13 Pages) Vishay Siliconix – Dual P-Channel 30 V (D-S) MOSFET

New Product
Dual P-Channel 30 V (D-S) MOSFET
Si7997DP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
- 30
R_DS(on) ()
0.0055 at V_GS = - 10 V
0.0078 at V_GS = - 4.5 V
PowerPAK^® SO-8
I_D (A)^a
- 60
- 60
Q_g (Typ.)
51 nC
6.15 mm
S1
1
G1
2
5.15 mm
S2
3
G2
4
D1
8
D1
7
D2
6
D2
5
Bottom View
Ordering Information: Si7997DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• PWM Optimized
• 100 % R_g Tested
• 100 % UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Battery and Load Switching ^S1
S₂
for Notebook PCs
G₁
G₂
D₁
D₂
P-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 30
V
V_GS
± 20
T_C = 25 °C
- 60^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 60^a
- 20.8^{b, c}
Pulsed Drain Current
T_A = 70 °C
- 16.6^{b, c}
A
I_DM
- 100
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 38
- 2.9^{b, c}
Single Pulse Avalanche Current
L = 0.1 mH
I_AS
- 30
Single Pulse Avalanche Energy
E_AS
45
mJ
T_C = 25 °C
46
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
29
3.5^{b, c}
W
T_A = 70 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
t  10 s
R_thJA
26
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
2.2
35
°C/W
2.7
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 85 °C/W.
Document Number: 66719
S10-1826-Rev. A, 09-Aug-10
www.vishay.com
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