SI7794DP Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET with Schottky Diode

New Product
Si7794DP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V_DS (V)
R_DS(on) ()
0.0034 at V_GS = 10 V
30
0.0042 at V_GS = 4.5 V
I_D (A)^a
60
60
Q_g (Typ.)
23 nC
PowerPAK^® SO-8
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• SkyFET™ Monolithic TrenchFET^® Gen III
Power MOSFET and Schottky Diode
• 100 % R_g Tested
• 100 % Avalanche Tested
• Compliant to RoHS Directive 2002/95/EC
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information: Si7794DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
APPLICATIONS
• Low Side in V_core, System and Memory
- Notebook PCs
D
G
N-Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 300 µs)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
I_DM
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T_C = 25 °C
T_A = 25 °C
I_S
L =0.1 mH
I_AS
E_AS
Maximum Power Dissipation
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
P_D
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_A = 70 °C
T_J, T_stg
Limit
30
± 20
60^a
60^a
28.6^{b, c}
22.8^{b, c}
80
60^a
5.6^{b, c}
40
80
48
31
5.0^{b, c}
3.2^{b, c}
- 55 to 150
260
Schottky
Diode
Unit
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
20
Steady State
R_thJC
2.1
25
°C/W
2.6
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
Document Number: 67692
www.vishay.com
S11-1150-Rev. A, 13-Jun-11
1
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000