SI5980DU Datasheet, PDF (1/7 Pages) Vishay Siliconix – Dual N-Channel 100-V (D-S) MOSFET

Si5980DU
Vishay Siliconix
Dual N-Channel 100-V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
100
0.567 at V_GS = 10 V
I_D (A)
2.5
Q_g (Typ.)
2.2 nC
PowerPAK^® ChipFET Dual
1
S1
2
D1
8
D1
7
6
G1
D2
D2
5
3
S2
4
G2
Marking Code
CE XXX
Lot Traceability
and Date Code
Part # Code
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
D₁
D₂
• Load Supply
• Power Supply
G₁
G₂
Bottom View
Ordering Information: Si5980DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
N-Channel MOSFET
S₂
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
T_C = 25 °C
2.5
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
2.0
1.3^{b, c}
Pulsed Drain Current
T_A = 70 °C
1.0^{b, c}
A
I_DM
3
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
6^a
1.7^{b, c}
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
I_AS
2
E_AS
0.2
mJ
T_C = 25 °C
7.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
5.0
2.0^{b, c}
W
T_A = 70 °C
1.3^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
49
Steady State
R_thJC
13
61
°C/W
16
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 65576
S10-0033-Rev. A, 11-Jan-10
www.vishay.com
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