SI5947DU Datasheet, PDF (1/7 Pages) Vishay Siliconix – Dual P-Channel 20-V (D-S) MOSFET

Dual P-Channel 20-V (D-S) MOSFET
Si5947DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.058 at V_GS = - 4.5 V
- 20
0.100 at V_GS = - 2.5 V
PowerPAK ChipFET Dual
1
S₁
2
D₁
G₁
8
D1
7
D2
6
D2
5
3
S2
4
G2
I_D (A)
- 6^a
- 6^a
Q_g (Typ.)
5.5 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
APPLICATIONS
• Load Switch, PA Switch, and Charger Switch for Portable
Devices
S₁
S₂
Marking Code
DE XXX
G₁
G₂
Lot Traceability
and Date Code
Bottom View
Part #
Code
Ordering Information: Si5947DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
D₁
P-Channel MOSFET
D₂
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 20
V
V_GS
± 12
Continuous Drain Current (T_J = 150 °C)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
- 6^a
- 6^a
- 5^{b, c}
Pulsed Drain Current
T_A = 70 °C
- 4^{b, c}
A
I_DM
- 20
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
T_C = 25 °C
- 6^a
- 1.9^{b, c}
10.4
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
6.7
2.3^{b, c}
W
T_A = 70 °C
1.5^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
43
Steady State
R_thJC
9.5
55
°C/W
12
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 73695
S09-0391-Rev. C, 09-Mar-09
www.vishay.com
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